BERGQUIST® SIL PAD TSP Q2500, substrat en film aluminium, remplacement de la graisse à base silicone pour le maximum de transfert thermique
BERGQUIST® SIL PAD TSP Q2500 is an aluminium film composite coated on both sides with thermally and electrically conductive Sil-pad rubber. The material is designed for applications requiring maximum heat transfer but no electrical insulation. BERGQUIST SIL PAD TSP Q2500 is the ideal interface material to replace messy thermal grease compounds. BERGQUIST SIL PAD TSP Q2500 eliminates problems associated with grease, such as contamination from reflow soldering or cleaning operations. Unlike grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations. BERGQUIST SIL PAD TSP Q2500 also eliminates dust deposits that can cause surface short circuits or heat build-up.
- Thermal impedance: 0.22°C-in²/W (at 50 psi)
- Maximum heat transfer
- Designed to replace thermal grease
- Coated with aluminium film on both sides to prevent heat build-up.
