BERGQUIST® SIL PAD TSP 1600, High-performance insulator for low-pressure applications
The BERGQUIST® SIL PAD TSP 1600 family of thermally conductive insulating materials is designed for applications requiring electrical insulation and high thermal performance. These applications also typically have low mounting pressures for component clamping. BERGQUIST SIL PAD TSP 1600 material offers both a smooth, highly conformable surface and high thermal conductivity. These characteristics optimise thermal resistance properties at low pressures.
- Thermal impedance: 0.45°C-in²/W (at 50 psi)
- High-value material
- Smooth, compliant surface
- Electrically insulating
