BERGQUIST® GAP PAD® TGP HC5000, silicone-based pad, highly conformable, thermally conductive, low modulus, glass fibre reinforced
BERGQUIST® GAP PAD® TGP HC5000 is a flexible gap filler material with a nominal thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures thanks to its unique filler and low modulus resin formulation. The improved material is ideal for applications requiring low stress on components and boards during assembly. BERGQUIST GAP PAD TGP HC5000 retains a conformable nature, providing excellent interface and wetting characteristics, even on rough and/or uneven surfaces.
- Highly flexible, low compression set
- Silicone-based
- Thermal conductivity: 5.0 W/m-K
- Reinforced with fibreglass for good shear and tear resistance
