BERGQUIST® GAP PAD® TGP HC3000, silicone-based pad, high compliance, thermally conductive, low modulus, glass fibre reinforced
BERGQUIST® GAP PAD® TGP HC30000 is an extremely flexible gap filler with a nominal thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures thanks to its unique 3.5 W/m-K filler and ultra-low modulus resin formulation. The enhanced material is well suited for high-performance applications requiring low assembly stress. BERGQUIST GAP PAD TGP HC3000 retains a conformable nature that provides excellent interface and wetting characteristics, even on rough and/or uneven surfaces. BERGQUIST GAP PAD TGP HC3000 is offered with inherent natural tack on one side of the material, eliminating the need for bulky thermal adhesive layers. The top has minimal tack for easy handling. BERGQUIST GAP PAD TGP HC3000 is supplied with protective coatings on both sides.
- Thermal conductivity: 3.0 W/m-K
- Silicone-free formula
- Low compression set
