BERGQUIST® GAP PAD® TGP EMI1000, conformable EMI absorption material, thermally conductive
BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable gap filler material that provides both thermal conductivity and electromagnetic energy absorption (cavity resonance and/or crosstalk causing electromagnetic interference) at frequencies of 1GHz and above. The material provides EMI suppression and thermal conductivity of 1.0 W/m-K with low assembly stress. The flexible nature of the material improves interface wetting and consequently thermal performance, which is better than that of harder materials, while providing a similar performance index.
- Thermal conductivity: 1.0 W/m-K
- Electromagnetic interference (EMI) absorption
- Reinforced with fibreglass for resistance to penetration, shearing and tearing
- Highly conformable, low hardness
