BERGQUIST® GAP PAD® TGP A2000, high-performance thermally conductive gap filler
BERGQUIST® GAP PAD® TGP A2000 acts as a thermal interface and insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP PAD TGP A2000 has natural tack on both sides, ensuring excellent conformability to component surfaces. The 40 mil thick material is supplied with lower tack on one side to allow for ageing processes and facilitate rework.
- Thermal conductivity: 2.0 W/m-K
- Reinforced with fibreglass for good resistance to perforation, shearing and tearing
- Electrical insulator
