BERGQUIST® GAP PAD TGP 6000ULM is an extremely flexible gap filling material with a nominal thermal conductivity of 6.0 W/m-K. It is specially designed for high performance applications requiring low assembly constraints. The material exhibits exceptional thermal performance at low pressures due to the unique gap filler material and ultra-low modulus resin. BERGQUIST GAP PAD TGP 6000ULM is highly conformable, even on very rough and/or irregular surfaces, ensuring excellent interface and wetting characteristics. BERGQUIST GAP PAD TGP 6000ULM is offered with a higher natural intrinsic tack on both sides of the material, which eliminates the need for thermally hindering adhesive layers and ensures bond-in-place characteristics during assembly. The top has minimal tack for ease of handling and rework. BERGQUIST GAP PAD TGP 6000ULM is supplied with protective coverings on both sides.
- Thermal conductivity: 6.0 W/m-K
- Very flexible, low compression compression
- Ultra low modulus
