BERGQUIST® GAP PAD® TGP 3004SF, polymer pad, silicone-free thermally conductive material, high performance
BERGQUIST® GAP PAD® TGP 3004SF is a high-performance, thermally conductive gap filler material with a thermal conductivity of 3.0 W/m-K. BERGQUIST GAP PAD TGP 3004SF is designed without silicone and offers extremely low interface resistance with adjacent surfaces. BERGQUIST GAP PAD TGP 3004SF is designed for silicone-sensitive applications BERGQUIST GAP PAD TGP 3004SF is constructed with a 0.25 mil PET film with a non-tack surface on one side and a natural tack surface on the other.
- Thermal conductivity: 3.0 W/m-K
- Silicone-free formula
- The adhesive side makes it easy to handle and position
- The 0.25 mil thick PET makes it easy to remove without leaving any residue
