BERGQUIST® GAP PAD® TGP 2700

bergquist-gap-pad-tgp-2700

BERGQUIST GAP PAD TGP 2700, non-reinforced gap filler material, thermally conductive.

BERGQUIST® GAP PAD TGP 2700 is a non-reinforced, electrically insulating, thermally conductive gap filler material. Glass fibre reinforcement makes the material easy to handle and improves resistance to puncture, shear and tear. BERGQUIST GAP PAD TGP 2700 is a polymer-filled material that produces an elastic polymer allowing for easy conversion and handling without the need for reinforcement. These properties also provide good interface and wetting characteristics on rough and/or uneven surfaces. All these characteristics make this material ideal for applications using clip or screw assemblies. BERGQUIST GAP PAD TGP 2700 is offered with intrinsic natural tack on both sides of the material, which provides adhesion characteristics during application assembly. The material is supplied with protective coatings on both sides.

  • Thermal conductivity: 2.7 W/m-K
  • High thermal performance, economical solution
  • Non-reinforced construction for additional compliance
  • Average conformability and compliance
Save as PDF

Downloads

BERGQUIST-GAP-PAD-TGP-2700-en_GL.pdf