BERGQUIST GAP PAD TGP 2400, reinforced, highly conformable, thermally conductive Class S gap filling material. BERGQUIST® GAP PAD TGP 2400 is a reinforced, thermally conductive material with a nominal thermal conductivity of 2.4 W/m-K.
The material is loaded with polymer which guarantees characteristics of extreme flexibility and elasticity. The material is reinforced to ensure ease of handling and conversion, additional electrical insulation and resistance to tearing. BERGQUIST GAP PAD TGP 2400 is ideally suited for low pressure applications typically using fixed position or clamp mounting. The material maintains a conformable yet elastic nature allowing excellent interface and wetting characteristics, even on very rough and/or irregular surfaces. BERGQUIST GAP PAD TGP 2400 is offered with an intrinsic natural tack on both sides of the material which allows for in-place adhesion characteristics during application assembly. It is also available with a tack-free side. See the Standard Options section for description. The material is supplied with protective coatings on both sides. The top has reduced tack for easier handling.
- Thermal conductivity: 2.4 W/m-K
- Low “class S” thermal resistance at very low pressure
- Ultra-conformable, “gel” module
- Designed for low stress applications
