BERGQUIST® GAP PAD® TGP 2101SF, silicone-free, thermally conductive gap filler
BERGQUIST® GAP FILLER® TGF 2101SF is a high-performance, silicone-free, thermally conductive gap filler. The material offers high thermal performance (2.0 W/mK) and is designed for silicone-sensitive applications. BERGQUIST GAP PAD TGP 2101SF is reinforced for easy handling of the material and added durability during assembly. BERGQUIST GAP PAD TGP 2101SF ensures exceptionally low interface resistances on neighbouring surfaces and is constructed with a 1 mil polyester film on one side and natural tack on the other. The 1 mil polyester film provides a non-tack surface that can be used to slide the pad or component into place during assembly.
- Thermal conductivity: 2.0 W/m-K
- No silicone outgassing
- No silicone extraction
- Adhesion on one side for easy handling
