BERGQUIST GAP PAD TGP 2000SF, silicone-free, thermally conductive gap filler.
BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this glass fibre reinforced gap filler, which provides both electrical insulation and exceptional thermal performance (2.0W/mK). While thermally conductive, the material is exceptionally flexible and more conformable than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is able to conform to most difficult contours while applying little stress to conductors.
- Thermal conductivity: 2 W/m-K
- Its natural adhesive properties reduce interface thermal resistance and facilitate assembly
- Reinforced with fibreglass for good resistance to perforation, shearing and tearing
- Conformable to difficult contours and preserves structural integrity with low stress on fragile component leads
