BERGQUIST® GAP PAD® TGP 2000, reinforced Class S gap filler material, highly conformable, thermally conductive
BERGQUIST® GAP PAD® TGP 2000 is recommended for low-stress applications requiring a moderately or highly thermally conductive interface material. The highly conformable nature of the material allows the pad to fill air gaps and air blades between computer boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stacking tolerances. BERGQUIST GAP PAD TGP 2000 is available with inherent natural tack on both sides of the material, allowing it to remain in place during application assembly. The material is supplied with protective coatings on both sides. The top has reduced tack to facilitate handling.
- Thermal conductivity: 2.0 W/mK
- Low thermal resistance ‘class S’ at very low pressure
- Designed for low-stress applications
- Highly conformable, low hardness
