BERGQUIST® GAP PAD® TGP 1500, silicone-based pad, non-reinforced, thermally conductive
BERGQUIST® GAP PAD® TGP 1500 has an ideal blend of fillers that gives it a low modulus, maintaining excellent thermal performance while allowing for easy handling. The natural tack on both sides of the material allows for good conformability to neighbouring component surfaces, reducing interface resistance.
- Non-reinforced construction for additional compliance
- Thermal conductivity: 1.5 W/m-K
- Electrically insulating
- Conformable, low hardness
