BERGQUIST® GAP PAD TGP 1000ULM is an extremely flexible gap filling material with a nominal thermal conductivity of 10.0 W/m-K. It is specially designed for high performance applications requiring low assembly constraints. The material exhibits exceptional thermal performance at low pressures due to the unique gap filler material and ultra-low modulus resin. BERGQUIST GAP PAD TGP 10000ULM is extremely conformable on rough or irregular surfaces, providing excellent wetting at the interface. Protective coatings are applied to both sides for ease of use.
- Thermal conductivity: 10W/m-K
- Ultra low modulus
