BERGQUIST® GAP FILLER TGF 4000, gap filler, thermally conductive, two-component, high-performance liquid
BERGQUIST® GAP FILLER TGF 4000 is a liquid, thermally conductive, high-performance, two-component gap filler. The mixed material cures at room temperature and can be accelerated by applying heat. BERGQUIST GAP FILLER TGF 4000 offers extended processing time, ensuring greater flexibility in the customer's assembly process. Thermal materials dispensed in liquid form offer an infinite range of thicknesses and place little or no stress on sensitive components during assembly. BERGQUIST GAP FILLER TGF 4000, which has low natural tack characteristics, is designed for applications that do not require strong structural adhesion. When cured, BERGQUIST GAP FILLER TGF 4000 provides a flexible, thermally conductive elastomer that is ideal for fragile assemblies or for filling single and interlocking gaps and voids.
- Thermal conductivity: 4.0 W/mK
- Ultra-conforming with excellent wetting
- 100% solids - no curing by-products
- Extended processing time for manufacturing flexibility
