BERGQUIST® GAP FILLER TGF 1500LVO, gap filler material, thermally conductive, two-part, high-performance liquid
BERGQUIST® GAP FILLER TGF 1500LVO is a high-performance, thermally conductive, two-part liquid gap filler material. This material guarantees high temperature resistance and a low modulus silicone material with significantly lower levels of silicone outgassing for silicone-sensitive applications. The mixed material cures at room temperature and can be accelerated by the application of heat. Once cured, BERGQUIST GAP FILLER TGF 1500LVO provides a flexible, thermally conductive elastomer formed in place, ideal for fragile assemblies or for filling single and interlocking gaps and voids. Thermal materials dispensed in liquid form offer an infinite number of thicknesses and place little or no stress on sensitive components during assembly. BERGQUIST GAP FILLER TGF 1500LVO, which has low natural tack characteristics, is designed for applications that do not require strong structural adhesion.
- Thermal conductivity: 1.8 W/mK
- Low volatility for silicone-sensitive applications
- Ultra-conforming with excellent wetting
- 100% solids — no curing by-products
