BERGQUIST® GAP FILLER TGF 1000, gap filler material, liquid, two-component, thermally conductive vibration damping
BERGQUIST® GAP FILLER TGF 1000 is a thermally conductive liquid gap filler. It is supplied as a two-component system that cures at room temperature or at elevated temperatures. The material is designed to ensure a balance between the properties of the cured material, enhanced by its low modulus, and good compression set. The result is a flexible elastomer that sets on application, ideal for bonding ‘hot’ electronic components mounted on printed circuit boards close to a metal enclosure or heat sink.
- Thermal conductivity: 1.0 W/m-K
- Ultra-conformable, designed for fragile and low-stress applications
- Room temperature and accelerated curing processes
- Room temperature and accelerated curing processes
