Introducing the GD25NX Series
Designed to deliver exceptional speed, reliability, and energy efficiency for a wide range of embedded systems. Combining innovative architecture with broad application flexibility, the GD25NX series is built to meet the demands of today’s most advanced SoC platforms.
Dual-Voltage Design for Lower Power and Lower Cost
The GD25NX series features a 1.8 V core and 1.2 V I/O interface, allowing direct connection to 1.2 V system-on-chip (SoC) designs without the need for external booster circuits. This approach not only reduces system power consumption but also cuts BOM costs, making it ideal for next-generation low-power applications.
High Speed and Throughput for Demanding Workloads
The GD25NX series supports an Octal SPI interface with a maximum clock rate of 200 MHz in both Single Transfer Rate (STR) and Double Transfer Rate (DTR) modes, enabling data throughput up to 400 MB/s. These performance characteristics translate to faster system boot times, quicker code execution, and improved responsiveness in data-intensive applications.
Thanks to optimized internal operations, the GD25NX achieves a typical page program time of 0.12 ms and a sector erase time of 27 ms — delivering approximately 30% faster programming and 10% faster erase performance compared with conventional 1.8 V octal Flash products.
Data Integrity and Signal Reliability
The GD25NX series integrates advanced ECC and CRC mechanisms to ensure high data integrity and long-term reliability. Support for Data Strobe (DQS) improves signal stability in high-speed designs, making the devices suitable for demanding environments such as automotive and data-center applications.
Optimized Power Efficiency
Thanks to its 1.2 V I/O architecture, the GD25NX delivers excellent power efficiency even at high operating speeds. At 200 MHz, current consumption is as low as 16 mA in Octal STR and 24 mA in Octal DTR, reducing read power consumption by up to 50% compared to conventional 1.8 V Octal Flash solutions.
Flexible Density and Package Options
The GD25NX family is available in 64 Mb and 128 Mb densities, with TFBGA24 (8 × 6 mm) and WLCSP (4 × 6 mm) package options, offering flexibility for both compact and high-performance embedded designs.
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