Delivering next-generation AI acceleration and industrial-grade performance for edge systems
SOM-COMe-BT6-PTL, a new COM Express Type 6 module with Intel Core Ultra Series 3 processors, offers immediate access to the latest generation of hybrid computing and AI capabilities for embedded and industrial applications. With up to 16 cores, Intel NPU 5 with 50 TOPS, Xe3 GPU, support for LPDDR5x/DDR5, PCIe Gen4/Gen5 and Thunderbolt, it is ideal for AI systems, industrial automation, smart retail, medical imaging and multi-camera vision. The module brings these capabilities to the COM Express Type 6 Basic standard, providing a flexible and scalable building block for next-generation embedded designs.
Key features of the SOM-COMe-BT6-PTL
The new module combines performance, AI acceleration, and rich connectivity within the Basic COM Express Type 6 footprint, including:
- Support for Intel Core Ultra Series 3 processors featuring hybrid core architecture
- Up to 50 TOPS on the Intel NPU 5
- Up to 180 platform TOPS AI acceleration
- Advanced graphics with Intel Arc GPU
- 2x So-DIMM slot, up to 128GB DDR5 memory supported
- PCIe Gen4/Gen5, USB 4.0 / Thunderbolt, and 2.5GbE for high-speed expansion
- Multiple display outputs (eDP, DP++, HDMI) for HMI and vision systems
- Optional Industrial temperature range for harsh environments
- Designed for long-term availability and integration into rugged and mission-critical designs
The new module integrates seamlessly with Clea, framework for IoT, AI infrastructure and device management, enabling customers to harness operational data, manage edge systems remotely, and deploy value-added services and AI applications. Through Clea OS 2.0, an embedded Linux distribution based on the Yocto Project, users can deploy, monitor, update, and secure edge devices at scale, while also simplifying compliance with EU cybersecurity regulations such as the CRA and RED.
